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Film/Panel lamination machine Label application machine Tape application machine


2012/05/17　 I am a traveler
2012/04/17　 Thank you for visiting FINTECH JAPAN

■ March/22/2012
Film/Panel lamination machine MPF-05-S II is added.

■ January/17/2012
Sendai factory 2nd site completed

■ January/16/2012
"Message from president" is updated.

■ November/02/2011
Label machine section
"Label application machines" is updated.

■ October/28/2011
Tokyo Office is relocated!
New route guides are updated "LOCATIONS"

■ October/21/2010
Product information
"SHEET TO SHEET lamination machine"
"ROLL TO SHEET lamination machine" updated.

■ April/07/2011
Product information"Label lamination machine" updated.

■ April/12/2010
Product information"Film/Panel lamination machine" updated.

■ March/03/2010
Product information"Flat surface tape application" updated.

■ February/03/2010
Product information"Pressure and explosion proof type" updated.
■ 2012/4/11(Wed) 〜 4/13(Fri)
TOKYO: 22nd FINTECH JAPAN
We had many visitors ! Thank you for visiting our stand
■ 2012/6/5(Tue) 〜 6/7(Thu)
BOSTON, USA: SID Display Week
Booth No. 661
■ 2012/6/19(Tue) 〜 6/21(Thu)
TAIPEI, TAIWAN: 14th Display Taiwan
Booth No. I1228
■ 2012/6/27(Wed) 〜 29(Fri)
TOKYO:25th　INTERPHEX JAPAN
Booth No. East 3 hall 5-3



* Film/Panel lamination machines
* Label Application Machines
* Tape application machines

* Company Overview
* Business Outline
* Locations
* Message From The President
* Company History
* Previous Site log and Exhibition schedule
* SUN-TEC Blog
* Contact Information

■SUN-TEC America (Arizona,USA)
　TEL : 1-480-922-5344 Mail : st-america-inquiry@sun-tec.net
■Sales Group at Head Quarter (Amagasaki, Hyogo)
　TEL : 81(0)6-6494-3260 Mail : st-inquiry@sun-tec.net
■Sales Group at Tokyo Branch (Chuo-ku, Tokyo)
　TEL : 81(0)3-5543-0670 Mail : st-inquiry@sun-tec.net
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